Sentiment analysis on product review using support vector machine (SVM)

Hidayah, Indriana and Permanasari, Adhistya Erna and Wijayanti, Nining Woro (2019) Sentiment analysis on product review using support vector machine (SVM). In: 5th International Conference on Science and Technology, 2019.

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Abstract

Public opinion can influence an organization or a company profile. It is important for the company to evaluate public response regarding their products. However, monitoring and organizing of public opinion are not easy. There are many published opinions in social media that is difficult to be processed manually. Therefore, a technique for automatically categorizing public reviews into positive or negative is needed. This research examined the classification of user reviews on products Windows Phone by implementing Support Vector Machine (SVM). This study used four different methods in tokenization stage: unigram, bigram, trigram, and n-gram. In the preprocessing data, there were 8 experiments whereas each group implemented 2 stemming algorithms (Snowball Stemmer and Iterated-Lovin Stemmer). The results were used as input of classification. Each input was classified 3 times with values C 0.25, 0.5, and 1.0. In conclusion, the result yielded the most appropriate model from n-gram with algorithm Iterated-Lovin Stemmer and C value 1.0. Finally, the use of SVM proves to be feasible approach of sentiment analysis regarding specific product.

Item Type: Conference or Workshop Item (Paper)
Additional Information: Library Dosen
Uncontrolled Keywords: Sentiment analysis; Social aspects; Appropriate models; Company profile; Product reviews; Public opinions; Public review; Stemming algorithms; Tokenization; Windows phones; Support vector machines
Subjects: T Technology > TK Electrical engineering. Electronics Nuclear engineering
Divisions: Faculty of Engineering > Electrical and Information Technology Department
Depositing User: Sri JUNANDI
Date Deposited: 05 Mar 2026 05:40
Last Modified: 05 Mar 2026 05:40
URI: https://ir.lib.ugm.ac.id/id/eprint/25208

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