The effect of deposition time on the microstructure and resistivity of cu/ni thin film prepared by magnetized electroplating

Thin films of Cu/Ni have been synthesized by the electroplating method assisted by a magnetic field on the variation of deposi tion time. The purpose of this paper was to investigate the dependence of sheets resistivity on microstructure obtained through XRD and SEM-EDX tests. Cu plates are used as cathodes and Ni plates as anodes. The electroplating process is carried out at DC voltage of 1.5 volt, 200 gauss magnetic field, 60° C solution temperature, and 4 cm electrode distance. Electrolyte solutions are made from a mixture of H<inf>3</inf>BO<inf>3</inf> (30 g), NiCl<inf>2</inf> (195 g), NiSO<inf>4</inf> (45 g), and H<inf>2</inf>O (750 ml). Deposition times varied from 5 s-45 s with intervals of 10 s. Based on the results of the microstructure test using XRD, all samples have a crystalline structure with intensity, d-spacing and grain size that varies with the time of deposition. From the EDS analysis, it is known that Ni deposit levels increase with increasing deposition time. The sheet resistivity range from (4.87 ± 0.02)�10^-3 Ω/sq to (1.38 ± 0.06) �10^-3 Ω/sq. © 2020 Elsevier B.V., All rights reserved.