Flow Boiling Heat Transfer Performance and Boiling Phenomena on Various Straight Fin Configurations

The trend of miniaturisation in recent decades has led to the development of compact electronic devices. The reduction in the required dimension leads to the exponential rise in the heat flux dissipated from such a system. A proper thermal management system is necessary to keep the temperature of a computer chip's junction within acceptable limits and maintain its performance. Flow boiling modification using straight fins in microchannels has proven to be an effective passive enhancement of the cooling system. The core interest of this research is figuring out the optimal configuration of the fin shapes and configurations. Hence, it is crucial to gain a comprehensive understanding of the flow boiling phenomenon to establish a more general approach. In this study, the boiling heat transfer performance of fin microchannels with various shapes and dimensions is investigated experimentally. The study has shown that the choice of fin geometry has a significant impact on the thermal performance of a heat transfer system. Specifically, the results indicate that a rectangular cross-section fin performs better than a trapezoidal one with the same fin gap. The rectangular cross-section fin exhibits the highest heat transfer coefficient of 5066.84 W/m2�K, outperforming the trapezoidal fin in terms of heat transfer capability. As the hydraulic diameter reduces, the thermal boundary layer becomes denser, providing a more distributed saturated region. This leads to the increase in the heat transfer coefficient up to 22.5% and 17.1% for rectangular and trapezoidal fins, respectively. Additionally, the efficiency analysis shows that, albeit increasing the mass flux and reducing the gap increase the average cooling performance, but the pressure drop jumps up to 48%, reducing the efficiency of the heat removal system.